3D Black Stencil Hard Disk

Product Features :
QianLi 3 In 1 3D BGA Reballing stencil template for iPhone universal NAND soldering repair.
100% new brand and high quality.
High-end imported steel sheet, ultra-thin steel plant tin template, just 0.12mm, easy to use.
Design : Square hole chamfering, standard manufacture of Qianli.
QianLi improved black steel mesh with square ventilation hole, prevent bulges and avoid hump on the BGA reballing stencil template.
Super Compatibility : for multi-model iPhone 6 7 8 X NAND repairing.
Professional for iPhone universal hard disk module NAND T0.12 Tin plant steel mesh.

Product Specifications :
Material : 3D BGA Rebaling Stencil Steel Mesh
Thickness : 0.12mm
Color : Black
Material : Stain Steel
Unit Type : Piece
100% : High Quality
Type : 3 In 1 BGA Reballing Stencil Template
Design : Square Hole Chamfering, Standard Manufacture of Qianli
Compatible : for iPhone 6 7 8 X NAND
Application : for iPhone 6 7 8 X NAND Soldering Repair
Suit for : iPhone Series Motherboard Rework
Function : iPhone Universal Hard Disk Reballing

What’s in the Package :
1* QianLi Black BGA Reballing Stencil Tempalte