QianLi ToolPlus Black 3D BGA Reballing Stencil Template for iPhone 5S 6 6S 7 8 X Power Logic Module, QianLi iPhone Power Logic Module Black BGA Reballing Stencil For iPhone5S 6 6S 7 8 X motherboard BGA Reballing Soldering Repair.

Product Features:
100% new brand and high quality.
High-end imported steel sheet, ultra-thin steel plant tin template, easy to use.
Design: Square hole chamfering, standard manufacture of Qianli.
QianLi improved black steel mesh with square ventilation hole, prevent bulges and avoid hump on the BGA reballing stencil template.
Super Compatibility: for iPhone 5S 6 6S 7 8 X Power Logic Module Repairing.

Product Specifications:
Material: 3D BGA Rebaling Stencil Steel Mesh
Color: Black
Design: Square Hole Chamfering, Standard Manufacture of Qianli
Compatible: for iPhone 8 8P X
Application: for iPhone 8 8P X Soldering Repair
Unit Type: Piece
Suit for: iPhone Series Motherboard Rework
Function: iPhone Universal Hard Disk Reballing
100%: High Quality

What’s in the Package:
1* QianLi Black 3D BGA Reballing Stencil Plate