BEST Tin Ball For IC Reballing (0.2MM,0.25MM,0.3MM)

BEST Tin Ball For IC Reballing (0.2MM,0.25MM,0.3MM)admin16/03/202416/03/2024

BEST Tin Ball For IC Reballing (0.2MM,0.25MM,0.3MM)

Rs.250.00

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Category: Uncategorized

Description
BEST BGA Reballing Balls 0.2mm 0.25mm 0.3mm 0.35mm 0.4mm 0.45mm 0.5mm 0.55mm 0.6mm 0.65mm Solder Ball
Features:
- Brand new and high quality.
- Solder (Tin) paste is the best choice of reballing IC.
- It is used instead of the pin in the IC component package structure.
Specificaton:
- Size: 0.2mm~0.65 mm to choose
- Quantity: 25,000PCS per Bottle
- Condition: Brand New
- Balls Alloy: Sn63/Pb37
- Standard: RoHS Available & SGS Tested
Package includes:
1 x Reballing Balls
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