JC Aixun Solder Paste AX-SP138M 50g 138 Degree Lead Free Silver

Features: 

AiXun lead free solder paste has different types in melting points so as to satisfy various soldering needs. The SP-138 degree low temperature paste is a special solder consumable that can be applied to iPhone X/XS/XSMAX middle frame and mainboard tin planting, the lead-free and silver containing formula is benefit for environmental protection. The tin balls it creates are delicate, round and full. It has a good viscosity, no blistering and even no solder bead. The SP-183 degree medium temperature nano flux paste is more suitable for welding and maintenance of after-sales mobile phone motherboard, nano chip, BGA, SMT reballing. It has a strong tin climbing ability, good conductivity and strong tin load capacity, which enables no rework after planting balls.

List of Packing:

1 x AX-138/183℃ PB free solder paste

Packing Details

100boxes/carton

Box dimension: 50*30*30mm

Carton dimension: 210*160*165mm