Kaisi Soldering Paste 183 degree (40g)15/03/2024
Kaisi Soldering Paste 183 degree (40g)
Rs.250.00
- Description
Kaisi 40g 183°C High-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair
Features:
- Kaisi 40g 183°C High-temperature solder paste, a high-temperature lead-free solder paste customised for high-end motherboard repair
- Tin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to Store
- High Density/High Resistance Strong Activity/Strong Welding Force
- Pure Alloy Composition/Fine Viscosity /Tin Plating Does Not Bubble Silver Highlights Good/Environmental Protection Without Any Chemical Pollution
- Meet the maintenance needs of motherboards for Huawei and Apple high-end machines
- Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on
- Good soldering and welding tool
Package includes:
- 1 x Solder Paste
- Reviews (0)
There are no reviews yet.