MiJing CH5-BC Platform for iPhone 11/11Pro/11ProMax

Mijing CH5 Intelligent motherboard preheating layered desoldering platform with CH5 CH5-BC CH5-E mold for iPhone X-12 Pro Max motherboard disassembly. Mijing CH5 motherboard heating separating welding platform for iPhone 12/11/X series PCB mainboard layering.

1. Preheating platform for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12mini/12 Pro/12 Pro Max motherboard layering, support CPU chip, HHD Nand flash, Baseband, glue removal.
2. Precise positioning, precise temperature, rapid temperature rise, non-slip weight increase, digital display temperature, extreme speed rise, fast stratification, safe disassembly, no damage to the motherboard.

Option:
1. MIJING CH5 host.
2. CH5 X/XS/XS MAX 3 in 1 groove.
3. CH5 B/C groove 3 in 1 for iPhone 11/11 Pro/11 Pro Max.
4. CH5 E groove 4 in 1 for iPhone 12/12 mini/12 Pro/12 Pro Max.

MIJING CH5 Main Unit:

• Product Size: 159 mm*89mm*48mm
• Material: Aluminum alloy
• Input voltage: 110V~220V
• Output voltage: 24V

Extended Heating Station:

• Product Size: 164mm*92mm*40mm
• Color: Grey + Blue
• Material: Aluminum alloy
• Double male adapter cable: 1m
• Power cable: 1m
• Max temperature: 300℃
• Min temperature: 100℃