Mijing Z20 Pro 18 in 1 iPhone X to 14 Pro Max
Rs.2,800.00
- Description
MiJing Z20 Pro 18 IN 1 Fixture For iPhone X-14 pro max Middle Layer Motherboard Reballing Soldering Platform With Stencil
MJ Z20 Pro 14 in 1 middle layer planting tin platform is a professional BGA reballing stencil fixture for iPhone X-13/13 Pro PCB BGA repair, mobile phone motherboard repair jig fixture used for positioning and reballing iPhone X-13 Pro Max PCB BGA parts.
Product Features :
iPhone X-13/13 Pro BGA reballing fixture tool.Used for positioning and reballing iPhone X- 13/13 Pro PCB BGA parts.Convenient and faster for reballing BGA without any damage.Offer you best solution for iPhone X-13/13 pro BGA reballing and repairing.
Usage Steps :
Take out the Z20 tin planter and place the bottom platePlace gaskets as needed (when planting tin in the RF middle frame of the XS Max motherboard, you need to place functional functional gaskets and then place the RF dedicated tin planting net)Place the main board and locate it through the positioning column and limit areaPlace the tin-planting net magnet according to the model to automatically adsorb the positioning hole and align the tin-planting station positioning postPlace tin spacers according to requirementsUse a tin scraper to evenly fill the mesh with tin paste
How to install :
Install the iPhone X-13/13 Pro main board on the platformCover the iPhone X-13/13Pro BGA reballing stencil on mainboardEvenly spread tin on the cover of the reballing stencilRemove the reballing stencil coverTake out the motherboard and cooperate with the hot air gun to solidify the tin point.
Packing List :
1pc x MiJing Z20pro Jig Fixture
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