Multifunctional Positioning Pressure Reducing Magic Pad

Multifunctional Positioning Pressure Reducing Magic Padadmin19/03/202419/03/2024

Multifunctional Positioning Pressure Reducing Magic Pad

Rs.350.00

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Category: Uncategorized

Description

Protective Pad Magic Pad Silicone Pad Specially Designed for BGA CPU IC Reballing

Characteristics:

1. Specially designed for BGA chip repair 2. Efficiently prevent tin dust caused by deformation of steel mesh. 3. Used for all ic chip reballing. And protect the ic from damage.
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