High-precision black 0.12 mm universal reballing stencil (model BZ-26) compatible with 0.3 mm, 0.35 mm, 0.4 mm and 0.5 mm ball pitches — ideal for mobile phone / PCB repair work.
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Model: BZ-26
Thickness: 0.12 mm, black finish
Universal design supporting multiple ball pitch sizes: 0.3 mm, 0.35 mm, 0.4 mm & 0.5 mm — all in one stencil.
Perfect for BGA / IC reballing operations in mobile phone, tablet, computer PCB repair and refurbishing work.
Durable metal template construction ensures accurate alignment of solder balls, high reflow yield, fewer defects.
Compatibly fits a wide range of chips / IC packages thanks to its universal nature – saves time, cost and simplifies tool inventory.
Easy to use: place the stencil over the chip pad, deposit solder balls, reflow, then remove stencil — leaving neatly placed solder balls.
Lightweight (approx. 0.01 kg per product as per listing) and compact for easy tool kit integration.
Supplied as: 1 × QianLi 0.12 mm Black Universal Reballing Stencil (BZ-26) per pack.
Ideal for professional repair technicians and hobbyists looking to improve precision and efficiency in BGA reballing tasks.
All-India shipping available, backed by trusted repair equipment store.
Usage Tips:
Ensure the chip/board surface is clean and properly tinned or prepped before applying the stencil to avoid bridging.
Align the stencil carefully with the pads; secure with tape or clip if needed.
Use appropriate sized solder balls (matching the pitch size) and follow recommended reflow profile for best results.
After reflow, remove the stencil gently to avoid disturbing solder joints.
Clean the stencil after use to extend its lifetime and maintain accuracy.
