• Model: BZ-26

• Thickness: 0.12 mm, black finish

• Universal design supporting multiple ball pitch sizes: 0.3 mm, 0.35 mm, 0.4 mm & 0.5 mm — all in one stencil.

• Perfect for BGA / IC reballing operations in mobile phone, tablet, computer PCB repair and refurbishing work.

• Durable metal template construction ensures accurate alignment of solder balls, high reflow yield, fewer defects.

• Compatibly fits a wide range of chips / IC packages thanks to its universal nature – saves time, cost and simplifies tool inventory.

• Easy to use: place the stencil over the chip pad, deposit solder balls, reflow, then remove stencil — leaving neatly placed solder balls.

• Lightweight (approx. 0.01 kg per product as per listing) and compact for easy tool kit integration.

• Supplied as: 1 × QianLi 0.12 mm Black Universal Reballing Stencil (BZ-26) per pack.

• Ideal for professional repair technicians and hobbyists looking to improve precision and efficiency in BGA reballing tasks.

• All-India shipping available, backed by trusted repair equipment store.

Usage Tips:

• Ensure the chip/board surface is clean and properly tinned or prepped before applying the stencil to avoid bridging.

• Align the stencil carefully with the pads; secure with tape or clip if needed.

• Use appropriate sized solder balls (matching the pitch size) and follow recommended reflow profile for best results.

• After reflow, remove the stencil gently to avoid disturbing solder joints.

• Clean the stencil after use to extend its lifetime and maintain accuracy.