The BS-1 BGA Reballing Stencil is a high-precision stainless steel stencil designed for accurate BGA IC reballing and solder ball replacement. It is ideal for professional mobile phone motherboard repair technicians and repair training institutes.
The BS-1 BGA Reballing Stencil is manufactured from premium-quality stainless steel to provide precise alignment and long-lasting performance during IC reballing. It ensures uniform solder ball placement, making chip repair faster, easier, and more reliable.
