IP6/6P Stencil is a high-precision BGA reballing stencil designed for iPhone 6 and iPhone 6 Plus motherboard repair. It provides accurate alignment for CPU, NAND, Power IC, and other IC reballing, making it an ideal tool for professional mobile repair technicians.
The IP6/6P Stencil is specially manufactured for accurate IC reballing on iPhone 6 and iPhone 6 Plus logic boards. Made from premium stainless steel, it offers excellent heat resistance, durability, and precise solder ball positioning.
