High-performance, no-clean flux paste for BGA/SMD/PCB rework — 100 g container, milky white colour, lead-free and RoHS compliant.
The Mechanic New UV-559 100 g Flux Paste is engineered for precision electronic repair and rework applications including mobile phones, tablets, PCBs, BGAs and PGAs. Its no-clean, lead-free formula delivers excellent solder wetting, rapid tinning, high insulation resistance and minimal residual interference — making it ideal for high-density assemblies and communication equipment.
Key Features:
No-clean flux paste: leaves minimal, non-corrosive, pale milky residue with high SIR (surface insulation resistance).
Lead-free and RoHS compliant — environmentally safe.
Excellent solderability: ensures bright solder joints, good wetting action, faster tinning, low smoke and reduced rework.
High insulation resistance after curing, reducing interference on sensitive electronics.
Specifically useful for mobile phone repair, PCB rework, SMD/BGA components, precision electronics.
Colour: milky-white (model UV-559). Configuration: approx. 100 g per unit.
Usage & Application Notes:
Use in a well-ventilated workspace.
Apply the flux to the solder pad/component area and proceed with standard soldering/reflow as required.
No cleaning required after soldering (due to no-clean formula), but ensure compatibility with your application and environment.
Store in a cool, dry place; keep container tightly sealed when not in use.
Package Includes:
1 × Mechanic New UV-559 Flux Paste — 100 g