The MI-17 BGA Reballing Stencil is a premium-quality stainless steel stencil designed for precise reballing of mobile ICs. It provides accurate alignment, excellent heat resistance, and long-lasting durability, making it ideal for repairing CPU, UFS, eMMC, PMIC, and other BGA chips used in smartphones.
The MI-17 BGA Reballing Stencil is specially engineered for professional mobile phone repair technicians who require high precision during BGA IC reballing. Manufactured from premium-grade stainless steel, it ensures accurate solder ball placement, consistent performance, and long service life.
Whether you're repairing damaged CPU, UFS, eMMC, PMIC, or other BGA ICs, the MI-17 stencil helps achieve clean and reliable reballing results.
