MQ-1 Stencil is a high-precision BGA reballing stencil designed for professional mobile phone motherboard and IC repair. Manufactured from durable stainless steel, it provides accurate solder ball alignment, excellent heat resistance, and long-lasting performance for precise reballing work.
The MQ-1 Stencil is a professional-grade reballing stencil specially designed for repairing mobile phone ICs and motherboards. Its precision laser-cut holes ensure accurate solder ball placement, making it ideal for technicians working on advanced mobile repair.
