MT-2 BGA Reballing Stencil – Professional Mobile Repair Tool

The MT-2 Stencil is specially designed for technicians performing BGA IC reballing and motherboard repair. Manufactured from premium-quality stainless steel, it provides precise hole alignment, excellent durability, and long-lasting performance.

Whether you are repairing CPU, eMMC, UFS, PMIC, or other BGA ICs, the MT-2 stencil helps achieve accurate solder ball placement, reducing repair time and improving success rates.

Features:

• High-quality stainless steel construction
• Precision laser-cut holes for accurate reballing
• Excellent heat resistance
• Reusable and durable
• Smooth surface for easy cleaning
• Suitable for professional repair shops
• Lightweight and easy to use
• Perfect for mobile motherboard repair
• Long service life
• Professional-grade quality