The OV-2 BGA Reballing Stencil is a high-quality stainless steel stencil designed for accurate BGA IC reballing and chip repair. It offers precise alignment, excellent heat resistance, and long-lasting durability, making it an ideal choice for professional mobile repair technicians.
The OV-2 BGA Reballing Stencil is manufactured from premium-grade stainless steel to ensure precise solder ball placement during BGA IC reballing. It is suitable for repairing various mobile motherboard chips, including CPU, eMMC, UFS, Power IC, and other BGA components.
