The OV-4 BGA Reballing Stencil is manufactured from premium-grade stainless steel to ensure long-lasting durability and precision. It is specially designed for mobile motherboard repair, allowing technicians to perform accurate BGA reballing with consistent results.

• Premium stainless steel construction for extended life.
• High-precision laser-cut holes for perfect solder ball alignment.
• Heat-resistant and anti-deformation design.
• Suitable for professional BGA IC reballing.
• Easy to clean and reusable multiple times.
• Ensures accurate positioning for efficient repairs.
• Lightweight and portable for workshop use.
• Ideal for mobile phone repair professionals and service centers.