Home / PM-3 BGA Reballing Stencil for Mobile CPU & IC Repair
p-1

PM-3 BGA Reballing Stencil for Mobile CPU & IC Repair

₹180 ₹ 200 10%
Availability: In Stock

PM-3 BGA Reballing Stencil ek high-precision stencil hai jo mobile CPU aur IC reballing ke liye design ki gayi hai. Stainless steel material se bana hua yeh stencil accurate alignment aur long-lasting performance provide karta hai.

Quantity:
Wishlist
Categories: Mobile Repair Tools
SKU code:PM-3
Genuine Product
Safe Payment
Pan India Delivery
No 1 Brand Mobile Tools
Product Description -:

M-3 BGA Reballing Stencil professional mobile repairing technicians ke liye ek reliable tool hai. Yeh stencil CPU aur IC reballing process ko fast, accurate aur easy banata hai.

Features:

  • Premium quality stainless steel construction
  • High precision laser-cut holes
  • Perfect alignment for accurate solder ball placement
  • Heat-resistant and reusable design
  • Long-lasting and corrosion-resistant material
  • Suitable for professional mobile repair workshops
  • Lightweight and easy to use
  • Ideal for BGA CPU & IC reballing applications

Related Products

View more
Home
Categories
0 Cart
Brands
Account