The RF-1 BGA Reballing Stencil is an essential tool for mobile repair technicians who perform CPU, eMMC, UFS, and IC reballing. Its precision-cut hole pattern ensures perfect solder ball alignment, making reballing faster, cleaner, and more accurate.

Key Features:

• High-quality stainless steel construction.
• Precision laser-cut holes for accurate solder ball placement.
• Heat-resistant and anti-deformation design.
• Suitable for professional BGA CPU and IC reballing.
• Smooth surface for easy cleaning and repeated use.
• Durable and long-lasting performance.
• Ideal for mobile repair laboratories and service centers.
• Compatible with hot air stations and BGA rework equipment.