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SAM-17 Samsung BGA Reballing Stencil

₹180 ₹ 200 10%
Availability: In Stock

SAM-17 Samsung BGA Reballing Stencil is a premium-quality stainless steel stencil designed for accurate Samsung CPU, UFS, eMMC and IC reballing. It offers precise alignment, high durability and excellent heat resistance, making it an ideal choice for professional mobile repair technicians.

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Categories: Mobile Repair Tools
SKU code:SAM-17
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No 1 Brand Mobile Tools
Product Description -:

The SAM-17 Samsung BGA Reballing Stencil is manufactured from high-grade stainless steel to provide accurate and reliable BGA reballing results. It is specially designed for Samsung motherboard IC repair, allowing technicians to rebuild solder balls with maximum precision.

  • Premium stainless steel construction
  • High precision laser-cut holes
  • Suitable for Samsung CPU, UFS, eMMC and other BGA ICs
  • Heat-resistant and warp-resistant design
  • Reusable for long-term professional use
  • Accurate alignment for perfect solder ball placement
  • Ideal for mobile phone repair shops and service centers
  • Lightweight, durable and easy to clean
  • Professional-grade quality for consistent performance

 

 

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