The SAM-6 BGA Reballing Stencil is specially designed for repairing Samsung motherboard ICs. Manufactured from premium stainless steel, it ensures precise solder ball placement, excellent heat resistance, and long service life. Whether you are replacing damaged solder balls or performing professional BGA rework, this stencil delivers reliable and accurate performance.

Key Features:

• High-quality stainless steel construction
• Precision laser-cut holes for accurate reballing
• Designed for Samsung BGA IC repair
• Heat-resistant and anti-deformation material
• Reusable for long-term professional use
• Smooth surface for easy cleaning
• Ideal for mobile repair shops and technicians
• Compatible with hot air and BGA rework stations
• Lightweight and easy to handle
• Suitable for advanced motherboard repairing