UQSD-2 Universal BGA Reballing Stencil is a premium stainless steel stencil designed for accurate IC reballing and chip repair. It provides precise alignment, high durability, and is ideal for repairing CPU, eMMC, UFS, PMIC, and other BGA ICs used in smartphones.
The UQSD-2 Universal BGA Reballing Stencil is a professional-grade tool made for mobile phone repair technicians. Manufactured from high-quality stainless steel, it ensures excellent heat resistance, long service life, and precise solder ball placement during BGA reballing.
Whether you're repairing Android or iPhone motherboards, the UQSD-2 stencil helps achieve accurate reballing results, reducing repair time and improving success rates.
