UQSD-5 BGA Reballing Stencil is a premium-quality precision stencil designed for accurate reballing of UFS and eMMC IC chips. Made from durable stainless steel, it provides excellent alignment, high heat resistance, and long-lasting performance for professional mobile repair technicians.
The UQSD-5 BGA Reballing Stencil is specially designed for professional mobile phone motherboard repair and BGA IC reballing. Manufactured using high-quality stainless steel, it ensures precise solder ball placement, making chip repair faster, cleaner, and more accurate.
