The 2UUL BH11 Universal Mobile Phone Middle Layer Frame BGA Reballing Magnetic Platform is a professional-grade repair tool specially designed for mobile phone technicians. It provides a firm and stable platform for fixing smartphone middle frames, motherboards, and PCB assemblies while performing BGA reballing, IC replacement, soldering, and micro-repair tasks.

The magnetic positioning system securely locks the workpiece, preventing movement during delicate repair operations. Built from premium aluminum alloy, the BH11 offers excellent heat resistance, durability, and long-lasting performance, making it an essential tool for professional repair workshops.

Key Features

• Universal design compatible with most smartphone middle frames and PCBs.
• Powerful magnetic locking system for secure positioning.
• Ideal for BGA reballing, IC replacement, soldering, and motherboard repair.
• Precision alignment improves repair accuracy.
• Heavy-duty aluminum alloy construction.
• Heat-resistant surface suitable for hot air rework.
• Anti-slip base provides maximum stability.
• Compact and lightweight for easy workstation setup.
• Suitable for Android and iPhone repair applications.
• Professional-quality tool for repair shops and technicians.