2UUL BG01 ABCD Reballing Stencil Set (4pcs) — precision reballing stencils designed for iPhone 8 and 16PM chip reballing work, ensuring accurate solder ball placement and fast chip-level repair.
The 2UUL BG01 ABCD Reballing Stencil Kit is an essential tool for professional mobile technicians engaged in BGA chip reballing and motherboard repairs. This high-precision stencil set is specifically designed for iPhone 8 and iPhone 16PM IC chips, ensuring accurate positioning and uniform solder ball application.
Made with premium quality metal and laser-cut accuracy, the BG01 stencils provide perfect alignment for solder balls during the reballing process, improving soldering reliability and reducing repair time.
Perfect for chip-level repair, IC reballing, and BGA rework stations in mobile repair shops and electronics service centers.
4pcs ABCD reballing stencil set
Designed for iPhone 8 / 16PM IC chips
High-precision laser cut stencils
Ensures accurate solder ball placement
Improves reballing quality & consistency
Durable metal build for repeated workshop use
Ideal for BGA rework and chip-level technicians
Smooth surface for effortless solder paste application
✔ iPhone motherboard repairs
✔ BGA reballing stations
✔ IC chip reballing
✔ Mobile repair technicians
✔ Electronic repair labs
