AU1 (IP CPU) Stencil is a high-precision BGA reballing stencil designed for iPhone CPU repair. Manufactured from premium stainless steel, it provides accurate alignment, excellent heat resistance, and long-lasting durability for professional mobile repair technicians.
he AU1 (IP CPU) Stencil is specially designed for accurate CPU reballing during iPhone motherboard repair. Its precision laser-cut holes ensure perfect solder ball placement, making reballing faster, easier, and more reliable.
