The MAK-7 BGA Reballing Stencil is a high-quality precision stencil designed for accurate IC and CPU reballing. Manufactured from durable stainless steel, it provides excellent heat resistance, precise hole alignment, and long-lasting performance for professional mobile phone repair technicians.
he MAK-7 Stencil is specially designed to simplify BGA and IC reballing during smartphone motherboard repairs. Its precision laser-cut holes ensure uniform solder ball placement, helping technicians achieve reliable and accurate repair results.
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