The USMG-5 Universal BGA Reballing Stencil is a high-quality stainless steel stencil designed for accurate IC, CPU, UFS, and eMMC reballing. It offers precise alignment, excellent heat resistance, and long-lasting durability, making it an ideal tool for professional mobile phone repair technicians.
The USMG-5 Universal BGA Reballing Stencil is manufactured from premium-grade stainless steel to ensure precise solder ball positioning during BGA IC reballing. It is suitable for repairing various smartphone motherboard ICs, including CPU, UFS, eMMC, PMIC, and other BGA chips.
Whether you own a mobile repair shop or an advanced repair laboratory, the USMG-5 Stencil provides consistent, accurate, and reliable reballing results while reducing repair time.
