HW-4 Stencil is a premium-quality BGA reballing stencil designed for precise solder ball rework on compatible mobile CPU and IC chips. Made from durable stainless steel, it provides accurate alignment, high heat resistance, and long-lasting performance for professional mobile repair technicians.
HW-4 BGA Reballing Stencil – Professional Mobile IC Repair Tool
The HW-4 Stencil is engineered for accurate BGA reballing and soldering of compatible mobile CPU and IC chips. Manufactured using premium stainless steel, it ensures excellent durability, precise hole alignment, and repeated use without deformation.
Whether you are replacing damaged ICs or performing professional motherboard repairs, the HW-4 stencil delivers clean and reliable solder ball placement for consistent repair results.
