The MQ-6 Stencil is a premium-quality stainless steel reballing stencil designed for precise BGA IC and mobile motherboard repair. It delivers accurate solder ball alignment, high heat resistance, and long-lasting durability for professional mobile repair technicians.
The MQ-6 Stencil is specially designed for professional smartphone repair and BGA IC reballing applications. Manufactured from premium-grade stainless steel, it features precision laser-cut holes that ensure accurate solder ball placement and reliable repair results.
Its durable construction allows repeated use under high temperatures without deformation, making it an ideal tool for mobile repair workshops and service centers.
