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MU-2 BGA Reballing Stencil for Mobile IC Repair

₹189 ₹ 200 6%
Availability: In Stock

The MU-2 BGA Reballing Stencil is a high-quality stainless steel stencil designed for accurate mobile IC reballing. It ensures precise solder ball alignment, excellent durability, and reliable performance, making it an essential tool for professional mobile repair technicians.

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Categories: Mobile Repair Tools
SKU code:MU-2
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No 1 Brand Mobile Tools
Product Description -:

The MU-2 BGA Reballing Stencil is manufactured using premium-grade stainless steel to deliver precise and consistent BGA reballing results. It is suitable for repairing mobile CPUs, eMMC, UFS, and other BGA ICs with professional accuracy.

Features:

  • Premium quality stainless steel construction
  • Precision laser-cut holes for perfect solder ball placement
  • Compatible with mobile CPU, eMMC, UFS and other BGA ICs
  • Heat-resistant and reusable for long-term use
  • Smooth finish for easy cleaning and maintenance
  • Accurate IC alignment for reliable reballing
  • Strong, durable and corrosion-resistant material
  • Lightweight and easy to use
  • Designed for professional mobile phone repair technicians
  • Delivers fast, accurate and consistent reballing performance

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