The MU-4 BGA Reballing Stencil is manufactured from premium-grade stainless steel to ensure durability, precision, and long service life. It is specially designed for mobile motherboard repair, allowing technicians to perform accurate reballing of various BGA ICs with ease.

Features:

• Premium quality stainless steel construction
• High precision laser-cut holes for perfect alignment
• Suitable for BGA IC, CPU, UFS, and eMMC reballing
• Heat-resistant and corrosion-resistant material
• Reusable and long-lasting design
• Easy to clean after use
• Provides accurate solder ball placement
• Ideal for professional mobile repair workshops
• Compatible with hot air and BGA rework stations