The MQ-2 Stencil is a high-precision BGA reballing stencil specially designed for professional mobile phone motherboard and IC repair. Made from premium stainless steel, it provides accurate solder ball alignment, high durability, and excellent heat resistance for reliable reballing results.
The MQ-2 Stencil is an essential tool for mobile repair technicians performing BGA IC reballing and motherboard repairs. Manufactured using premium stainless steel with precision laser cutting, it ensures perfect alignment and consistent solder ball placement.
