The BS-2 BGA Reballing Stencil is manufactured using premium-quality stainless steel for long-lasting performance and precise solder ball placement. It is suitable for professional mobile repair engineers who require accurate and reliable IC reballing during motherboard repairs.

Features:

• High-quality stainless steel construction
• Precision laser-cut holes for accurate solder ball alignment
• Heat-resistant and anti-deformation design
• Reusable and durable for long-term use
• Smooth surface for easy cleaning
• Ideal for professional BGA IC reballing
• Lightweight and easy to use
• Suitable for mobile motherboard repair and chip replacement
• Designed for repair shops, technicians, and training institutes