AMAOE MAK-4 Stencil is a high-precision stainless steel BGA reballing stencil designed for professional mobile repairing. It ensures accurate solder ball alignment for CPU, eMMC, UFS, and other IC reballing applications with excellent durability and precision.
The AMAOE MAK-4 Stencil is specially designed for professional mobile repair technicians who require accurate and reliable BGA reballing results. Manufactured from premium-grade stainless steel, it provides precise hole alignment, high heat resistance, and long service life.
