The WTR-1 BGA Reballing Stencil is a high-quality precision stencil specially designed for repairing and reballing water-damaged mobile ICs. Manufactured from durable stainless steel, it provides accurate alignment, excellent heat resistance, and long-lasting performance for professional mobile repair technicians.
WTR-1 BGA Reballing Stencil – Professional Mobile IC Repair Tool
The WTR-1 Stencil is engineered for technicians performing precise BGA IC reballing and PCB repairs. Its premium stainless steel construction ensures durability while maintaining perfect hole alignment for consistent solder ball placement.
