WC-1 BGA Reballing Stencil is a high-precision stainless steel stencil designed for accurate IC reballing and BGA chip repair. It is ideal for professional mobile phone technicians and repair centers.
The WC-1 BGA Reballing Stencil is manufactured from premium quality stainless steel to ensure precise solder ball alignment and long-lasting durability. It is specially designed for mobile motherboard IC reballing and chipset repair work.
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