High-performance RELIFE RL-403 PPD solder paste (Sn63/Pb37) engineered for mobile PCB, BGA and motherboard repair – melting point 183 °C, 20-38 µm alloy particles, viscosity 160-230 Pa·s. Ideal for precision injection and rework.
Description:
The RELIFE RL-403 PPD Solder Paste Injection – 183 °C is a professional-grade solder paste designed specifically for smartphone, PCB, BGA and motherboard rework applications. Formulated with Sn63/Pb37 alloy, this solder paste ensures reliable joints, excellent flow and consistent performance under rework conditions.
Key Features:
Alloy Composition: Sn63 / Pb37 (63 % tin, 37 % lead) for excellent wetting and saturated flow.
Melting Point: 183 °C – optimal for standard mobile PCB repair and rework applications.
Particle Size: 20-38 µm — fine consistent particles suitable for injection and precise soldering work.
Viscosity: 160-230 Pa·s — designed for controlled dispensing and minimal sag in vertical reflow or hot-air rework.
Package: 10 cc (approx. 35 g) syringe-injection format – convenient for SMT/BGA repair. Ideal for: mobile phone motherboard repair, BGA ball re-balling, SMT pad rework, fine pitch device repair.
Usage Tips:
Pre-heat substrate moderately before applying to improve flow and minimize voids.
Use under controlled hot-air, infrared or reflow station set above 183 °C for best results.
Store in cool, dry place; reseal syringe after use to preserve flux activity.
Package Contents:
1 × Solder Paste (RELIFE RL-403 PPD 10 cc)
