The MT-6886V Stencil is designed to meet the needs of professional mobile repair technicians. Its precision laser-cut design ensures accurate solder ball alignment, making IC reballing faster, easier, and more reliable.

Manufactured from premium-grade stainless steel, the MT-6886V stencil is resistant to heat and deformation, making it ideal for repeated use in mobile repair workshops. It is suitable for reballing various BGA IC chips such as CPU, eMMC, UFS, PMIC, and other smartphone motherboard components.

Features:

• Premium quality stainless steel construction
• Precision laser-cut openings for accurate reballing
• Excellent heat and corrosion resistance
• Durable and reusable design
• Smooth surface for easy cleaning
• Lightweight and easy to use
• High accuracy for professional repairs
• Suitable for CPU, eMMC, UFS, PMIC, and other BGA ICs
• Ideal for smartphone motherboard repair
• Professional-grade mobile repair tool