HU-3 Stencil is a high-precision BGA reballing stencil designed for accurate CPU and IC reballing during mobile phone motherboard repairs. Made from premium stainless steel for durability, precision, and repeated professional use.
HU-3 Stencil is specially designed for professional technicians who require precise BGA reballing of mobile CPU and IC chips. Manufactured from premium stainless steel, it provides accurate alignment, excellent heat resistance, and long-lasting durability for repeated repair work.
