The Universal BGA Reballing Stencil is a high-quality precision stencil designed for professional mobile repairing and IC reballing. It supports multiple smartphone motherboard ICs including CPU, eMMC, UFS, Power IC, and other BGA chips, making it an essential tool for repair technicians.
The Universal Stencil is manufactured from premium stainless steel to provide accurate solder ball alignment and long-lasting durability. It is compatible with a wide range of smartphone motherboard ICs and is ideal for repairing Android and iPhone devices.
Key Features:
