The SAM-20 Samsung BGA Reballing Stencil is manufactured using high-grade stainless steel to provide long-lasting performance and accurate solder ball positioning during BGA reballing. Designed specifically for Samsung motherboard repair, this stencil ensures consistent and reliable results while minimizing alignment errors.

Features:

• High-quality stainless steel construction
• Precision laser-cut hole pattern
• Suitable for Samsung CPU, UFS, eMMC & Power IC reballing
• Heat-resistant and corrosion-resistant material
• Reusable and durable for long-term use
• Accurate alignment for professional repair work
• Lightweight and easy to handle
• Ideal for mobile repairing shops and service centers
• Accurate alignment for professional repair work
• Lightweight and easy to handle
• Ideal for mobile repairing shops and service centers