he iPad 2 / iPad Mini Reballing BGA Stencil is specially designed for professional mobile repair technicians. It provides accurate solder ball alignment for CPU, NAND, PMIC, and other motherboard IC reballing jobs.

Made from premium stainless steel, the stencil offers excellent heat resistance and durability, making it suitable for repeated professional use.

Features:

• Compatible with iPad 2 & iPad Mini motherboard ICs.
• High-precision laser-cut holes.
• Premium stainless steel construction.
• Heat-resistant and corrosion-resistant.
• Accurate solder ball alignment.
• Ideal for CPU, NAND, PMIC & BGA IC reballing.
• Professional-grade repair quality.
• Reusable and long-lasting.
• Lightweight and easy to use.
• Suitable for mobile repair shops and training institutes.