The SAM-19 Samsung BGA Reballing Stencil is made from premium-grade stainless steel for precise and reliable IC reballing. Designed for Samsung CPU, UFS, eMMC and PMIC chip repair, it provides accurate alignment, excellent durability, and long-lasting performance for professional mobile repair technicians.
The SAM-19 Samsung BGA Reballing Stencil is a high-quality precision stencil specially designed for Samsung motherboard chip reballing. Manufactured using durable stainless steel, it ensures perfect solder ball placement and accurate alignment for successful IC repair.
Key Features:
