he SSD-2 BGA Reballing Stencil is a premium-quality stainless steel stencil designed for accurate BGA IC reballing in mobile phone repair. It provides precise solder ball alignment, excellent heat resistance, and long-lasting durability, making it ideal for professional technicians and repair centers.
The SSD-2 BGA Reballing Stencil is manufactured from high-grade stainless steel to deliver precise and reliable BGA reballing results. It is suitable for repairing various smartphone ICs, including CPU, eMMC, UFS, PMIC, and other BGA chips. The precision laser-cut holes ensure perfect solder ball placement while reducing errors during the reballing process.
