The MQ-4 Stencil is a high-precision stainless steel reballing stencil designed for professional mobile phone motherboard and IC repair. It ensures accurate solder ball placement, excellent heat resistance, and long-lasting durability for reliable BGA reballing.
The MQ-4 Stencil is engineered for mobile repair professionals who require precision and reliability. Made from premium-grade stainless steel, it features laser-cut holes for perfect solder ball alignment, helping technicians achieve accurate and efficient BGA IC reballing.
