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UQSD-3 BGA Reballing Stencil for Mobile PCB Repair

₹180 ₹ 200 10%
Availability: In Stock

UQSD-3 BGA Reballing Stencil is a premium-quality stainless steel stencil designed for accurate BGA IC reballing and mobile motherboard repair. It offers precise hole alignment, high heat resistance, and long-lasting durability for professional technicians.

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Categories: Mobile Repair Tools
SKU code:UQSD-3
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No 1 Brand Mobile Tools
Product Description -:

he UQSD-3 BGA Reballing Stencil is specially designed for professional mobile repairing technicians. Manufactured from premium stainless steel, it provides accurate solder ball alignment for CPU, eMMC, UFS, PMIC, and other BGA IC reballing applications.

Key Features:

  • High-quality stainless steel construction
  • Precision laser-cut hole design
  • Accurate BGA IC reballing
  • Heat-resistant and anti-warp material
  • Durable and reusable for long-term use
  • Smooth surface for easy solder ball placement
  • Ideal for mobile motherboard repair
  • Professional-grade repair tool
  • Lightweight and easy to use
  • Suitable for repair shops and training institutes

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