The MU-6 BGA Reballing Stencil is a premium-quality stainless steel stencil designed for accurate and reliable mobile IC reballing. It offers precise alignment, excellent heat resistance, and long-lasting durability, making it ideal for repairing CPU, UFS, eMMC, PMIC, and other BGA chips used in smartphones.
The MU-6 BGA Reballing Stencil is engineered for professional mobile phone technicians who require high precision during BGA IC reballing. Manufactured from premium stainless steel, this stencil ensures accurate solder ball placement and consistent performance in every repair.
Whether you're repairing smartphones, tablets, or other electronic devices, the MU-6 stencil delivers clean and reliable reballing results while minimizing alignment errors.
