A precision 6-in-1 tin-planting platform from the brand MECHANIC, featuring automatic magnetic positioning and a leakage-proof design — ideal for repairing mid-level iPhone motherboards (iPhone X/XS/XS Max/11/11 Pro/11 Pro Max).
Brand: MECHANIC. Item no: iBGA Max.
Size: 97 × 76 × 20 mm.
Strong magnetic automatic positioning – built-in magnetic adsorption for precise alignment and zero offset. Anti-leakage tin barrier design – includes a leak-proof tin plate to protect the motherboard from tin paste spill.
Made of special-grade steel mesh material with high temperature resistance up to ~500 °C; no bulging or deformation under heat.
Supports re-balling / tin-planting on mid-level mobile phone motherboards such as iPhone X / XS / XS Max / 11 / 11 Pro / 11 Pro Max.
Integrated and removable tin-planting fixture, positioning slots for double-sided motherboards.
Package includes: 1× BGA re-balling / tin-planting platform.
