Brand: MECHANIC. Item no: iBGA Max. 

Size: 97 × 76 × 20 mm. 

Strong magnetic automatic positioning – built-in magnetic adsorption for precise alignment and zero offset. Anti-leakage tin barrier design – includes a leak-proof tin plate to protect the motherboard from tin paste spill. 

Made of special-grade steel mesh material with high temperature resistance up to ~500 °C; no bulging or deformation under heat. 

Supports re-balling / tin-planting on mid-level mobile phone motherboards such as iPhone X / XS / XS Max / 11 / 11 Pro / 11 Pro Max. 

Integrated and removable tin-planting fixture, positioning slots for double-sided motherboards. 

Package includes: 1× BGA re-balling / tin-planting platform.