The SAM-18 Samsung BGA Reballing Stencil is a premium-quality stainless steel stencil designed for accurate Samsung IC, CPU, UFS, and eMMC chip reballing. It delivers precise alignment, excellent durability, and consistent performance, making it an essential tool for professional mobile repair technicians.
The SAM-18 Samsung BGA Reballing Stencil is engineered to provide accurate and reliable BGA reballing for Samsung motherboard chips. Manufactured from premium stainless steel, it ensures long-lasting durability, heat resistance, and precise solder ball alignment.
